Audible signal attenuating printed circuit board

ABSTRACT

A printed circuit board (PCB) incorporates at least one damping layer or section. The at least one damping layer is incorporated in the PCB to absorb vibrations or oscillations that may be conveyed to the PCB. Such vibrations or oscillations may be generated by one or more electrical components coupled to the PCB. The damping layer is disposed to prevent the PCB from audibly vibrating when the electrical components associated with the PCB are caused to vibrate or pulsate under a voltage load.

BACKGROUND

Portable computing devices such as laptops, media players, cellularphones, head mounted displays (HMDs) etc., have become small, light andpowerful. One factor contributing to this reduction in size can beattributed to the manufacturer's ability to fabricate various componentsof these devices in smaller and smaller sizes while in most casesincreasing the power and or operating speed of such components. Anotherfactor contributing to the reduction in size is that from a visualstandpoint, users often find compact and sleek designs of consumerelectronic devices more aesthetically appealing and thus, demand compactand sleek designs. The trend of smaller, lighter, more compact andpowerful presents continuing challenges in the design of portablecomputing devices and its associated components.

Printed circuit boards (PCBs) are used in most portable computingdevices. In general, a PCB accommodates the interconnection of variouselectrical components. For example, a plurality of transistors,capacitors, inductors, and the like, may be interconnected using a PCB.The PCB may have a plurality of vias and traces to accommodateinterconnecting the various electrical components mounted to the PCB.Furthermore, the PCB may include different conductive and nonconductivedielectric layers. The conductive layers may incorporate the pluralityof vias and traces, while the nonconductive or insulating dielectriclayers may function to separate or isolate one or more of the conductivelayers. A PCB that includes a plurality of conductive and nonconductivelayers is often referred to as a multilayer PCB.

A computing device incorporating one or more PCBs may apply a voltage tothe electrical components associated with the one or more PCBs. Thevoltage applied to the electrical components may cause the one or moreof the electrical components to change shape or deform due toelectrostriction. For example, a voltage may cause some of theelectrical components to vibrate or pulsate. The vibration caused by theelectrical components may be transmitted to the PCB and cause the PCB tovibrate. The vibration of the PCB may be undesirably audible to a userof the computing device. Human perceptible sound associated with thevibration of a PCB is particularly problematic when associated withcomputing devices (e.g., cell phones and HMDs) that are often used closeto a user's ear.

SUMMARY

The disclosed techniques provide a printed circuit board (PCB) thatincorporates at least one damping layer or section. The at least onedamping layer is incorporated in the PCB to absorb vibrations oroscillations that may be conveyed to the PCB. Such vibrations oroscillations may be generated by one or more electrical componentscoupled to the PCB. The damping layer is disposed to prevent the PCBfrom audibly vibrating when the electrical components associated withthe PCB are caused to vibrate or pulsate under a voltage load.

In some implementations, a PCB incorporates a plurality of layers. Thelayers include conductive and nonconductive layers. A vibration dampinglayer may be disposed between one or more of the conductive and/ornonconductive layers to absorb vibrations or oscillations transmitted tothe PCB via one or more electrical components associated with the PCB.

In some implementations, a vibration damping layer may be disposed in anarea of a PCB below an electrical component coupling interfaceassociated with the PCB. For example, the vibration damping layer may bedisposed below the electrical interface that includes a capacitorcoupled thereto. In some implementations, the vibration damping layermay be disposed adjacent to the electrical interface.

The PCB may employ a plurality of vibration damping layers. Some of theplurality of vibration damping layers may be disposed directly below anelectrical component coupling interface of the PCB, and some of theplurality of damping layers may be disposed adjacent to an electricalcomponent coupling interface of the PCB.

A vibration damping layer associated with a PCB may comprise anymaterial sufficient to absorb vibrations or oscillations generated byone or more electrical components coupled to the PCB. For example, thevibration damping layer may be a comprised of polymer, such as silicone,polypropylene, or polyurethane. In some implementations, the vibrationdamping layer may be comprised of a sheet of resin impregnated witheither continuous fiber or discontinuous chopped fiber that dissipatesvibrations or oscillations that may be generated by the one or moreelectrical components coupled to the PCB. In some implementations, thevibration damping layer may be comprised of a layer of resin that doesnot contain fibers or other fillers.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key or essentialfeatures of the claimed subject matter, nor is it intended to be used asan aid in determining the scope of the claimed subject matter. The term“techniques,” for instance, may refer to system(s), method(s),computer-readable instructions, module(s), algorithms, hardware logic,and/or operation(s) as permitted by the context described above andthroughout the document.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is described with reference to the accompanyingfigures. In the figures, the left-most digit(s) of a reference numberidentifies the figure in which the reference number first appears. Thesame reference numbers in different figures indicate similar oridentical items.

FIG. 1 is cross sectional view of a printed circuit board (PCB) 100 thatincludes vibration damping properties, in accordance with one or moreexemplary implementations.

FIG. 2 is cross sectional view of a PCB that includes vibration dampingproperties, in accordance with one or more exemplary implementations.

FIG. 3 is cross sectional view of a PCB that includes vibration dampingproperties, in accordance with one or more exemplary implementations.

FIG. 4 includes a diagram of an example flowchart that illustratesoperations associated with manufacturing at least one of the disclosedPCBs. FIG. 4 further illustrates a PCB at various stages of manufacture.

FIG. 5 is a front-view of an example of an implementation of anexemplary computing device that may implement one or more of thedisclosed PCBs.

FIG. 6 illustrates a computer architecture diagram illustrating anillustrative hardware and software architecture that may use one or moreof the disclosed PCBs.

DETAILED DESCRIPTION

The disclosed techniques provide a printed circuit board (PCB) thatincorporates at least one damping layer or section. The at least onedamping layer is incorporated in the PCB to absorb vibrations oroscillations that may be conveyed to the PCB. Such vibrations oroscillations may be generated by one or more electrical componentscoupled to the PCB. The damping layer is disposed to prevent the PCBfrom audibly vibrating when the electrical components associated withthe PCB are caused to vibrate or pulsate under a voltage load.

In some implementations, a PCB incorporates a plurality of layers. Thelayers include conductive and nonconductive layers. A vibration dampinglayer may be disposed between one or more of the conductive and/ornonconductive layers to absorb vibrations or oscillations transmitted tothe PCB via one or more electrical components associated with the PCB.

In some implementations, a vibration damping layer may be disposed in anarea of a PCB below an electrical component coupling interfaceassociated with the PCB. For example, the vibration damping layer may bedisposed below the electrical interface that includes a capacitorcoupled thereto. In some implementations, the vibration damping layermay be disposed adjacent to the electrical interface.

The PCB may employ a plurality of vibration damping layers. One or moreof the plurality of vibration damping layers may be disposed directlybelow an electrical component coupling interface of the PCB, and one ormore of the plurality of damping layers may be disposed adjacent to anelectrical component coupling interface of the PCB.

A vibration damping layer associated with a PCB may comprise anymaterial sufficient to absorb vibrations or oscillations generated byone or more electrical components coupled to the PCB. For example, thevibration damping layer may be a comprised of polymer, such as silicone,polypropylene, or polyurethane. In some implementations, the vibrationdamping layer may be comprised of a sheet of resin impregnated witheither continuous fiber or discontinuous chopped fiber that dissipatesvibrations or oscillations that may be generated by the one or moreelectrical components coupled to the PCB. In some implementations, thevibration damping layer may be comprised of a layer of resin that doesnot contain fibers or other fillers.

Various examples, implementations, scenarios, and aspects are describedbelow with reference to FIGS. 1 through 6.

FIG. 1 is cross sectional view of a printed circuit board (PCB) 100 thatincludes vibration damping properties, in accordance with one or moreexemplary implementations. The PCB 100 may include at least oneelectrical component 102 coupled thereto. In some implementations, theelectrical component 102 is a capacitor. The capacitor may be any knowntype of capacitor. In some implementations, the capacitor is a ceramiccapacitor. For example, the capacitor may be a multilayer ceramiccapacitor. The PCB 100 may include a plurality of electrical componentscoupled thereto.

The electrical component 102 may include a plurality of electricalterminals 104. The plurality of electrical terminals 104 may couple theelectrical component 102 to the PCB 100. For example, the plurality ofelectrical terminals 104 may couple to electrical component interfaces106 associated with the PCB 100. The electrical component interfaces 106may be PCB contact pads. Solder 108 may be used to couple the pluralityof electrical terminals 104 to the electrical component interfaces 106.

The PCB 100 may comprise a plurality of PCB layers 110 (e.g., PCB layers110_1-110_3). The PCB layers 110 may include dielectric layers,conductive layers, nonconductive layers, and the like. In someimplementations, at least one or more of the PCB layers 110 is a glassfiber layer. Furthermore, in some implementations, at least one or moreof the PCB layers 110 comprises gold, silver, and/or copper. In someimplementations, the PCB 100 may comprise one or more vias (notillustrated in FIG. 1).

One or more electrical components, such as the electrical component 102,may change shape or deform due to electrostriction. For example, theelectrical component 102 may vibrate or pulsate 118 when a voltage isapplied thereto. The vibration 118 from the electrical component 102 maybe transmitted to the PCB 100. The transmitted vibration 118 from theelectrical component 102 may cause the PCB 100 to vibrate.

In some scenarios, the vibration associated with the PCB 100 is audibleto a user of a device containing the PCB 100. For example, the PCB 100may be associated with a computing device, such as a laptop computer,mobile device, head mounted display (HMD), or the like. Audiblevibrations associated with the PCB 100 may be undesirable to the user ofthe computing device. Particularly, audible vibrations associated withthe PCB 100 may be highly undesirable to a user of a computing device(e.g., HMD) that may be used in close proximity to an ear of the user.

A vibration damping layer 112 may be associated with the PCB 100. Thevibration damping layer 112 is disposed as part of the PCB 100 to absorbvibrations 118 conveyed to the PCB 100 from one or more of theelectrical components 102.

In some implementations, the vibration damping layer 112 comprises atleast one of silicone, polypropylene, and polyurethane. Furthermore, insome implementations, the vibration damping layer 112 comprises a wovenfiber cloth impregnated with a resin. In some implementations, thevibration damping layer 112 comprises the resin. The resin may includecontinuous or discontinuous fibers.

The vibration damping layer 112 may absorb a sufficient amount of thevibrations 118 conveyed to the PCB 100 from one or more of theelectrical components 102, to thereby prevent the PCB 100 from producingvibrations audible to a user of the PCB 100. In some implementations,the vibration damping layer 112 has a height H that is between 0.1 mmand 0.5 mm. A height H falling in the indicated range has been found toefficiently mitigate audible vibrations associated with the PCB 100,while at the same time allowing manufacture of the PCB 100 withouthaving to increase a height and/or width of the PCB 100.

In some implementations, the vibration damping layer 112 is disposedbelow the electrical component 102. Specifically, the vibration dampinglayer 112 may have a length L1 that is equal or substantially equal to alength L2 of the electrical component 102. In some implementations, avibration damping layer portion of the vibration damping layer 112 mayat least partially overlap an electrical terminal portion of one or moreof the electrical terminals 104. In addition, the vibration dampinglayer 112 may be disposed over the PCB layer 110_2, such that thevibration damping layer 112 is in close proximity to the electricalcomponent 102. The arrangement illustrated in FIG. 1 may provide optimumvibration damping properties for the PCB 100.

The PCB 100 may include, as described, a plurality of electricalcomponents 102 coupled to the PCB 100. The PCB 100 may include avibration damping layer 112 disposed below each of the plurality ofelectrical components 102, in a similar manner as illustrated in FIG. 1.

In some implementations, the vibration damping layer 112 is in the formof a patch applied to at least one of the PCB layers 110 of the PCB 100.Specifically, the vibration damping layer 112 in the form of a patch maybe applied on a surface of the PCB layer 110_2 prior to disposing thePCB layer 110_1 over the PCB layers 110_2 and 110_3.

FIG. 2 is cross sectional view of a PCB 200 that includes vibrationdamping properties, in accordance with one or more exemplaryimplementations. The PCB 200 includes the vibration damping layer 112.The vibration damping layer 112 may at least partially overlap thelength 116 of the electrical component 102. In some implementations, aportion of vibration damping layer of the vibration damping layer 112may at least partially overlap an electrical terminal portion associatedwith at least one of the electrical terminals 104. The arrangementillustrated in FIG. 2 may be particularly advantageous when a secondelectrical component 202 is arranged in close proximity to theelectrical component 102. Specifically, the arrangement of the vibrationdamping layer 112, as illustrated in FIG. 2, functions to absorbvibrations that may be generated by each of the electrical components102 and 202.

FIG. 3 is cross sectional view of a PCB 300 that includes vibrationdamping properties, in accordance with one or more exemplaryimplementations. The PCP 300 includes a plurality of the vibrationdamping layers 112. Specifically, as illustrated, a first vibrationdamping layer 112 is disposed above the PCB layer 110_2. Furthermore, aplurality of additional vibration dampening layers 112 is disposed abovethe PCB layer 110_3. The use of the plurality of the vibration dampinglayers 112 may further enhance the vibration damping propertiesassociated with the PCB 300.

As should be readily understood by this disclosure, the PCBs 100, 200and 300 may implement any number of vibration damp damping layers 112.

FIG. 4 includes a diagram of an example flowchart 400 that illustratesoperations associated with manufacturing the PCBs 100, 200 and/or 300.FIG. 4 further illustrates the PCBs 100, 200 and/or 300 at variousstages of manufacture. In one example, the operations of FIG. 4 may beperformed by components of one or more known exemplary systems tomanufacture PCBs. Such known exemplary systems are able to arrange andbond PCB layers using known techniques. Such known techniques to arrangeand bond PCB layers include coupling various PCB layers at roomtemperature using epoxy or other bonding material. In otherimplementations, known techniques to arrange and bond PCB layers includecoupling various PCB layers at temperatures that are higher than roomtemperature. A PCB with bonded layers may then be patterned, drilledand/or stacked to accommodate any connection or electrical componenttype. Furthermore, vias may be created in the PCB after the PCB layerbonding process.

Turning to FIG. 4, a first PCB layer is provided at operation 402. Forexample, the first PCB layer may be the PCB layer 110_2.

At operation 404, a vibration damping layer is provided over the firstPCB layer. For example, the vibration damping layer may be the vibrationdamping layer 112.

At operation 406, a second PCB layer is provided over the vibrationdamping layer and the first PCB layer. For example, the second PCB layermay be the PCB layer 110_1.

At operation 408, an electrical component interface is provided on asurface of the second PCB layer. For example, the electrical componentinterface may comprise the electrical component interfaces 106.

At operation 410, a third PCB layer including another vibration dampinglayer disposed on a surface thereof is provided below the second PCBlayer. For example, the third PCB layer may comprise the PCB layer 110_3and another vibration damping layer may comprise the vibration dampinglayer 112 disposed on a surface of the PCB layer 110_3.

An electrical component, such as the electrical component 102, may becoupled to the electrical component interface provided at the operation408.

FIG. 5 is a front-view of an example of an implementation of anexemplary computing device that may implement one or more of thedisclosed PCBs 100, 200, and 300. Specifically, FIG. 5 illustrates afront-view of an example implementation of a mixed reality HMD 500 thatmay implement one or more of the disclosed PCBs 100, 200, and/or 300. Inthis example, the HMD 500 includes a body 502, transparent visor 504,and first optical payload 506 and a second optical payload 508.

A vibration suppressing PCB, such as the disclosed PCBs 100, 200, and/or300, is particularly advantageous when implemented in the HMD 500. Inparticular, the HMD 500 is worn in close proximity to a user's ears.Therefore, suppression of audible vibrations that may be generated by aPCB and one or more electrical components coupled thereto is necessaryto optimize a user's use and enjoyment of the HMD 500.

Turning now to FIG. 6, an illustrative computing device architecture 600for computing devices that may implement the exemplary PCBs describedherein is provided. The computing device architecture 600 is applicableto computing devices that facilitate mobile computing due, in part, toform factor, wireless connectivity, and/or battery-powered operation. Insome configurations, the computing devices include, but are not limitedto, digital pens, digital inking devices, mobile telephones, tabletdevices, slate devices, portable video game devices, and the like.

The computing device architecture 600 may implement any of the devicesand structures shown in the accompanying figures. Moreover, aspects ofthe computing device architecture 600 may be applicable to traditionaldesktop computers, portable computers, e.g., phones, laptops, notebooks,ultra-portables, and netbooks, server computers, and other computersystems, such as those described herein. For example, the single touchand multi-touch aspects disclosed herein below may be applied to desktopcomputers that utilize a touchscreen or some other touch-enabled device,such as a touch-enabled track pad or touch-enabled mouse. In someimplementations, some or all of the computer device architecture 600implements one or more of the exemplary devices or structures (e.g.,PCBs) described herein.

The computing device 600 illustrated in FIG. 6 includes a processor 602,memory components 604, network connectivity components 606, sensorcomponents 608, input/output components 610, and power components 612.In the illustrated configuration, the processor 602 is in communicationwith the memory components 604, the network connectivity components 606,the sensor components 608, the input/output (“I/O”) components 610, andthe power components 612. Although no connections are shown between theindividual components illustrated in FIG. 6, the components can interactto carry out device functions. In some configurations, the componentsare arranged so as to communicate via one or more busses (not shown onFIG. 6).

The processor 602 includes a central processing unit (“CPU”) configuredto process data, execute computer-executable instructions of one or moreapplication programs, and communicate with other components of thecomputing device architecture 600 in order to perform variousfunctionality described herein. The processor 602 may be utilized toexecute aspects of the software components presented herein and,particularly, those that utilize, at least in part, a touch-enabledinput.

In some configurations, the processor 602 includes a graphics processingunit (“GPU”) (not shown on FIG. 6) configured to accelerate operationsperformed by the CPU, including, but not limited to, operationsperformed by executing general-purpose scientific and/or engineeringcomputing applications, as well as graphics-intensive computingapplications such as high resolution video (e.g., 720P, 1080P, andhigher resolution), video games, three-dimensional (“3D”) modelingapplications, and the like. In some configurations, the processor 602 isconfigured to communicate with a discrete GPU (not shown on FIG. 6). Inany case, the CPU and GPU may be configured in accordance with aco-processing CPU/GPU computing model, wherein the sequential part of anapplication executes on the CPU and the computationally-intensive partis accelerated by the GPU.

In some configurations, the processor 602 is, or is included in, asystem-on-chip (“SoC”) (not shown on FIG. 6) along with one or more ofthe other components described herein below. For example, the SoC mayinclude the processor 602, a GPU, one or more of the networkconnectivity components 606, and one or more of the sensor components608. In some configurations, the processor 602 is fabricated in partutilizing a package-on-package (“PoP”) integrated circuit packagingtechnique. The processor 602 may be a single core or multi-coreprocessor.

The processor 602 may be created in accordance with an ARM architecture,available for license from ARM HOLDINGS of Cambridge, United Kingdom.Alternatively, the processor 602 may be created in accordance with anx86 architecture, such as is available from INTEL CORPORATION ofMountain View, Calif. and others. In some configurations, the processor602 is a SNAPDRAGON SoC, available from QUALCOMM of San Diego, Calif., aTEGRA SoC, available from NVIDIA of Santa Clara, Calif., a HUMMINGBIRDSoC, available from SAMSUNG of Seoul, South Korea, an Open MultimediaApplication Platform (“OMAP”) SoC, available from TEXAS INSTRUMENTS ofDallas, Tex., a customized version of any of the above SoCs, or aproprietary SoC.

The memory components 604 include a random-access memory (“RAM”) 614, aread-only memory (“ROM”) 616, an integrated storage memory (“integratedstorage”) 618, and a computer readable medium (“CRM”) 620. In someconfigurations, the RAM 614 or a portion thereof, the ROM 616 or aportion thereof, and/or some combination of the RAM 614 and the ROM 616is integrated in the processor 602. In some configurations, the ROM 616is configured to store a firmware, an operating system or a portionthereof (e.g., operating system kernel), and/or a bootloader to load anoperating system kernel from the integrated storage 618 and/or the CRM620.

The integrated storage 618 can include a solid-state memory, a harddisk, or a combination of solid-state memory and a hard disk. Theintegrated storage 618 may be soldered or otherwise connected to a logicboard upon which the processor 602 and other components described hereinalso may be connected. As such, the integrated storage 618 is integratedin the computing device. The integrated storage 618 is configured tostore an operating system or portions thereof, application programs,data, and other software components described herein.

The computer-readable media (CRM) 620 can include a solid-state memory,a hard disk, or a combination of solid-state memory and a hard disk. Insome configurations, the CRM 620 is provided in lieu of the integratedstorage 618. In other configurations, the CRM 620 is provided asadditional optional storage. In some configurations, the CRM 620 islogically combined with the integrated storage 618 such that the totalavailable storage is made available as a total combined storagecapacity. In some configurations, the total combined capacity of theintegrated storage 618 and the CRM 620 is shown to a user instead ofseparate storage capacities for the integrated storage 618 and theremovable storage 620.

As used herein, computer-readable media can store instructionsexecutable by the processing unit(s) 602. Computer-readable media canalso store instructions executable by external processing units such asby an external CPU, an external GPU, and/or executable by an externalaccelerator, such as an FPGA type accelerator, a DSP type accelerator,or any other internal or external accelerator. In various examples, atleast one CPU, GPU, and/or accelerator is incorporated in a computingdevice, while in some examples one or more of a CPU, GPU, and/oraccelerator is external to a computing device.

Computer-readable media can include computer storage media and/orcommunication media. Computer storage media can include one or more ofvolatile memory, nonvolatile memory, and/or other persistent and/orauxiliary computer storage media, removable and non-removable computerstorage media implemented in any method or technology for storage ofinformation such as computer-readable instructions, data structures,program modules, or other data. Thus, computer storage media includestangible and/or physical forms of media included in a device and/orhardware component that is part of a device or external to a device,including but not limited to random access memory (“RAM”), staticrandom-access memory (“SRAM”), dynamic random-access memory (“DRAM”),phase change memory (“PCM”), read-only memory (“ROM”), erasableprogrammable read-only memory (“EPROM”), electrically erasableprogrammable read-only memory (“EEPROM”), flash memory, rotating media,optical cards or other optical storage media, magnetic storage, magneticcards or other magnetic storage devices or media, solid-state memorydevices, storage arrays, network attached storage, storage areanetworks, hosted computer storage or any other storage memory, storagedevice, and/or storage medium that can be used to store and maintaininformation for access by a computing device.

In contrast to computer storage media, communication media can embodycomputer-readable instructions, data structures, program modules, orother data in a modulated data signal, such as a carrier wave, or othertransmission mechanism. As defined herein, computer storage media doesnot include communication media. That is, computer storage media doesnot include communications media consisting solely of a modulated datasignal, a carrier wave, or a propagated signal, per se.

Although the various configurations have been described in languagespecific to structural features and/or methodological acts, it is to beunderstood that the subject matter defined in the appendedrepresentations is not necessarily limited to the specific features oracts described. Rather, the specific features and acts are disclosed asexample forms of implementing the claimed subject matter. The claimedsubject matter may be embodied in other ways, may include differentelements or operations, and may be used in conjunction with otherexisting or future technologies. This description should not beinterpreted as implying any particular order or arrangement among orbetween various operations or elements except when the order ofindividual operations or arrangement of elements is explicitlydescribed.

It can be understood that one or more of the memory components 604 canstore an operating system. According to various configurations, theoperating system includes, but is not limited to WINDOWS MOBILE OS fromMicrosoft Corporation of Redmond, Wash., WINDOWS PHONE OS from MicrosoftCorporation, WINDOWS from Microsoft Corporation, PALM WEBOS fromHewlett-Packard Company of Palo Alto, Calif., BLACKBERRY OS fromResearch In Motion Limited of Waterloo, Ontario, Canada, IOS from AppleInc. of Cupertino, Calif., and ANDROID OS from Google Inc. of MountainView, Calif. Other operating systems are contemplated.

The network connectivity components 606 include a wireless wide areanetwork component (“WWAN component”) 622, a wireless local area networkcomponent (“WLAN component”) 624, and a wireless personal area networkcomponent (“WPAN component”) 626. The network connectivity components606 facilitate communications to and from the network 656 or anothernetwork, which may be a WWAN, a WLAN, or a WPAN. Although only thenetwork 656 is illustrated, the network connectivity components 606 mayfacilitate simultaneous communication with multiple networks, includingthe networks referred to in any description herein. For example, thenetwork connectivity components 606 may facilitate simultaneouscommunications with multiple networks via one or more of a WWAN, a WLAN,or a WPAN.

The network 656 may be or may include a WWAN, such as a mobiletelecommunications network utilizing one or more mobiletelecommunications technologies to provide voice and/or data services toa computing device utilizing the computing device architecture 600 viathe WWAN component 622. The mobile telecommunications technologies caninclude, but are not limited to, Global System for Mobile communications(“GSM”), Code Division Multiple Access (“CDMA”) ONE, CDMA7000, UniversalMobile Telecommunications System (“UMTS”), Long Term Evolution (“LTE”),and Worldwide Interoperability for Microwave Access (“WiMAX”). Moreover,the network 656 may utilize various channel access methods (which may ormay not be used by the aforementioned standards) including, but notlimited to, Time Division Multiple Access (“TDMA”), Frequency DivisionMultiple Access (“FDMA”), CDMA, wideband CDMA (“W-CDMA”), OrthogonalFrequency Division Multiplexing (“OFDM”), Space Division Multiple Access(“SDMA”), and the like. Data communications may be provided usingGeneral Packet Radio Service (“GPRS”), Enhanced Data rates for GlobalEvolution (“EDGE”), the High-Speed Packet Access (“HSPA”) protocolfamily including High-Speed Downlink Packet Access (“HSDPA”), EnhancedUplink (“EUL”) or otherwise termed High-Speed Uplink Packet Access(“HSUPA”), Evolved HSPA (“HSPA+”), LTE, and various other current andfuture wireless data access standards. The network 656 may be configuredto provide voice and/or data communications with any combination of theabove technologies. The network 656 may be configured to or adapted toprovide voice and/or data communications in accordance with futuregeneration technologies.

In some configurations, the WWAN component 622 is configured to providedual-multi-mode connectivity to the network 656. For example, the WWANcomponent 622 may be configured to provide connectivity to the network656, wherein the network 656 provides service via GSM and UMTStechnologies, or via some other combination of technologies.Alternatively, multiple WWAN components 622 may be utilized to performsuch functionality, and/or provide additional functionality to supportother non-compatible technologies (i.e., incapable of being supported bya single WWAN component). The WWAN component 622 may facilitate similarconnectivity to multiple networks (e.g., a UMTS network and an LTEnetwork).

The network 656 may be a WLAN operating in accordance with one or moreInstitute of Electrical and Electronic Engineers (“IEEE”) 802.11standards, such as IEEE 802.11a, 802.11b, 802.11g, 802.11n, and/orfuture 802.11 standard (referred to herein collectively as WI-FI). Draft802.11 standards are also contemplated. In some configurations, the WLANis implemented utilizing one or more wireless WI-FI access points. Insome configurations, one or more of the wireless WI-FI access points areanother computing device with connectivity to a WWAN that is functioningas a WI-FI hotspot. The WLAN component 624 is configured to connect tothe network 656 via the WI-FI access points. Such connections may besecured via various encryption technologies including, but not limitedto, WI-FI Protected Access (“WPA”), WPA2, Wired Equivalent Privacy(“WEP”), and the like.

The network 656 may be a WPAN operating in accordance with Infrared DataAssociation (“IrDA”), BLUETOOTH, wireless Universal Serial Bus (“USB”),Z-Wave, ZIGBEE, or some other short-range wireless technology. In someconfigurations, the WPAN component 626 is configured to facilitatecommunications with other devices, such as peripherals, computers, orother computing devices via the WPAN. For instance, all digital inkingdevices 100 disclosed herein can be in communication with a pairedcomputer 101 via a BLUETOOTH connection, a WI-FI connection, WI-FIDIRECT connection, etc.

The sensor components 608 include a magnetometer 628, an ambient lightsensor 630, a proximity sensor 632, an accelerometer 634, a gyroscope636, and a Global Positioning System sensor (“GPS sensor”) 638. It iscontemplated that other sensors, such as, but not limited to,temperature sensors or shock detection sensors, also may be incorporatedin the computing device architecture 600.

The magnetometer 628 is configured to measure the strength and directionof a magnetic field. In some configurations the magnetometer 628provides measurements to a compass application program stored within oneof the memory components 604 in order to provide a user with accuratedirections in a frame of reference including the cardinal directions,north, south, east, and west. Similar measurements may be provided to anavigation application program that includes a compass component. Otheruses of measurements obtained by the magnetometer 628 are contemplated.

The ambient light sensor 630 is configured to measure ambient light. Insome configurations, the ambient light sensor 630 provides measurementsto an application program stored within one the memory components 604 inorder to automatically adjust the brightness of a display (describedbelow) to compensate for low-light and high-light environments. Otheruses of measurements obtained by the ambient light sensor 630 arecontemplated.

The proximity sensor 632 is configured to detect the presence of anobject or thing in proximity to the computing device without directcontact. In some configurations, the proximity sensor 632 detects thepresence of a user's body (e.g., the user's face) and provides thisinformation to an application program stored within one of the memorycomponents 604 that utilizes the proximity information to enable ordisable some functionality of the computing device. For example, atelephone application program may automatically disable a touchscreen(described below) in response to receiving the proximity information sothat the user's face does not inadvertently end a call or enable/disableother functionality within the telephone application program during thecall. Other uses of proximity information as detected by the proximitysensor 632 are contemplated.

The accelerometer 634 is configured to measure proper acceleration. Insome configurations, output from the accelerometer 634 is used by anapplication program as an input mechanism to control some functionalityof the application program. For example, the application program may bea video game in which a character, a portion thereof, or an object ismoved or otherwise manipulated in response to input received via theaccelerometer 634. In some configurations, output from the accelerometer634 is provided to an application program for use in switching betweenlandscape and portrait modes, calculating coordinate acceleration, ordetecting a fall. Other uses of the accelerometer 634 are contemplated.

The gyroscope 636 is configured to measure and maintain orientation. Insome configurations, output from the gyroscope 636 is used by anapplication program as an input mechanism to control some functionalityof the application program. For example, the gyroscope 636 can be usedfor accurate recognition of movement within a 3D environment of a videogame application or some other application. In some configurations, anapplication program utilizes output from the gyroscope 636 and theaccelerometer 634 to enhance control of some functionality of theapplication program. Other uses of the gyroscope 636 are contemplated.

The GPS sensor 638 is configured to receive signals from GPS satellitesfor use in calculating a location. The location calculated by the GPSsensor 638 may be used by any application program that requires orbenefits from location information. For example, the location calculatedby the GPS sensor 638 may be used with a navigation application programto provide directions from the location to a destination or directionsfrom the destination to the location. Moreover, the GPS sensor 638 maybe used to provide location information to an external location-basedservice, such as E911 service. The GPS sensor 638 may obtain locationinformation generated via WI-FI, WIMAX, and/or cellular triangulationtechniques utilizing one or more of the network connectivity components606 to aid the GPS sensor 638 in obtaining a location fix. The GPSsensor 638 may also be used in Assisted GPS (“A-GPS”) systems. The GPSsensor 638 can also operate in conjunction with other components, suchas the processor 602, to generate positioning data for the computingdevice 600.

The I/O components 610 include a display 640, a touchscreen 642, a dataI/O interface component (“data I/O”) 644, an audio I/O interfacecomponent (“audio I/O”) 646, a video I/O interface component (“videoI/O”) 648, and a camera 650. In some configurations, the display 640 andthe touchscreen 642 are combined. In some configurations two or more ofthe data I/O component 644, the audio I/O component 646, and the videoI/O component 648 are combined. The I/O components 610 may includediscrete processors configured to support the various interfacesdescribed below, or may include processing functionality built-in to theprocessor 602.

In some configurations, the computing device 600 can include feedbackdevice 651, such as an actuator or solid-state circuit configured tophysically vibrate in response to a haptic signal. The processing unitscan cause the generation of a haptic signal associated with a generatedhaptic effect to feedback device 651, which in turn outputs hapticeffects such as vibrotactile haptic effects, electrostatic frictionhaptic effects, or deformation haptic effects.

The feedback device 651 includes a drive circuit. The feedback device651 may be, for example, an electric motor, an electro-magneticactuator, a voice coil, a shape memory alloy, an electro-active polymer,a solenoid, an eccentric rotating mass motor (“ERM”), a linear resonantactuator (“LRA”), a piezoelectric actuator, a high bandwidth actuator,an electroactive polymer (“EAP”) actuator, an electrostatic frictiondisplay, or an ultrasonic vibration generator. In alternate embodiments,computing device 600 can include one or more feedback devices 651.

The feedback device 651 is an example of a haptic output device, where ahaptic output device is a device configured to output haptic effects,such as vibrotactile haptic effects, electrostatic friction hapticeffects, or deformation haptic effects, in response to a drive signal.In alternate embodiments, the feedback device 651 can be replaced bysome other type of haptic output device. Further, in other alternateembodiments, computing device 600 may not include an actuator, and aseparate device from the computing device 600 includes an actuator, orother haptic output device, that generates the haptic effects, andcomputing device 600 sends generated haptic signals to that devicethrough a communication device.

The display 640 is an output device configured to present information ina visual form. In particular, the display 640 may present graphical userinterface (“GUI”) elements, text, images, video, notifications, virtualbuttons, virtual keyboards, messaging data, Internet content, devicestatus, time, date, calendar data, preferences, map information,location information, and any other information that is capable of beingpresented in a visual form. In some configurations, the display 640 is aliquid crystal display (“LCD”) utilizing any active or passive matrixtechnology and any backlighting technology (if used). In someconfigurations, the display 640 is an organic light emitting diode(“OLED”) display. Other display types are contemplated.

The touchscreen 642, also referred to herein as a “touch-enabledscreen,” is an input device configured to detect the presence andlocation of a touch. The touchscreen 642 may be a resistive touchscreen,a capacitive touchscreen, a surface acoustic wave touchscreen, aninfrared touchscreen, an optical imaging touchscreen, a dispersivesignal touchscreen, an acoustic pulse recognition touchscreen, or mayutilize any other touchscreen technology.

In some configurations, the touchscreen 642 is incorporated on top ofthe display 640 as a transparent layer to enable a user to use one ormore touches to interact with objects or other information presented onthe display 640. In other configurations, the touchscreen 642 is a touchpad incorporated on a surface of the computing device that does notinclude the display 640. For example, the computing device may have atouchscreen incorporated on top of the display 640 and a touch pad on asurface opposite the display 640.

In some configurations, the touchscreen 642 is a single-touchtouchscreen. In other configurations, the touchscreen 642 is amulti-touch touchscreen. In some configurations, the touchscreen 642 isconfigured to detect discrete touches, single touch gestures, and/ormulti-touch gestures. These are collectively referred to herein asgestures for convenience. Several gestures will now be described. Itshould be understood that these gestures are illustrative and are notintended to limit the scope of the appended claims. Moreover, thedescribed gestures, additional gestures, and/or alternative gestures maybe implemented in software for use with the touchscreen 642. As such, adeveloper may create gestures that are specific to a particularapplication program.

In some configurations, the touchscreen 642 supports a tap gesture inwhich a user taps the touchscreen 642 once on an item presented on thedisplay 640. The tap gesture may be used for various reasons including,but not limited to, opening or launching whatever the user taps. In someconfigurations, the touchscreen 642 supports a double tap gesture inwhich a user taps the touchscreen 642 twice on an item presented on thedisplay 640. The double tap gesture may be used for various reasonsincluding, but not limited to, zooming in or zooming out in stages. Insome configurations, the touchscreen 642 supports a tap and hold gesturein which a user taps the touchscreen 642 and maintains contact for atleast a pre-defined time. The tap and hold gesture may be used forvarious reasons including, but not limited to, opening acontext-specific menu.

In some configurations, the touchscreen 642 supports a pan gesture inwhich a user places a finger on the touchscreen 642 and maintainscontact with the touchscreen 642 while moving the finger on thetouchscreen 642. The pan gesture may be used for various reasonsincluding, but not limited to, moving through screens, images, or menusat a controlled rate. Multiple finger pan gestures are alsocontemplated. In some configurations, the touchscreen 642 supports aflick gesture in which a user swipes a finger in the direction the userwants the screen to move. The flick gesture may be used for variousreasons including, but not limited to, scrolling horizontally orvertically through menus or pages. In some configurations, thetouchscreen 642 supports a pinch and stretch gesture in which a usermakes a pinching motion with two fingers (e.g., thumb and forefinger) onthe touchscreen 642 or moves the two fingers apart. The pinch andstretch gesture may be used for various reasons including, but notlimited to, zooming gradually in or out of a web site, map, or picture.

Although the above gestures have been described with reference to theuse of one or more fingers for performing the gestures, other appendagessuch as toes or objects such as styluses may be used to interact withthe touchscreen 642. As such, the above gestures should be understood asbeing illustrative and should not be construed as being limiting in anyway.

The data I/O interface component 644 is configured to facilitate inputof data to the computing device and output of data from the computingdevice. In some configurations, the data I/O interface component 644includes a connector configured to provide wired connectivity betweenthe computing device and a computer system, for example, forsynchronization operation purposes. The connector may be a proprietaryconnector or a standardized connector such as USB, micro-USB, mini-USB,or the like. In some configurations, the connector is a dock connectorfor docking the computing device with another device such as a dockingstation, audio device (e.g., a digital music player), or video device.

The audio I/O interface component 646 is configured to provide audioinput and/or output capabilities to the computing device. In someconfigurations, the audio I/O interface component 646 includes amicrophone configured to collect audio signals. In some configurations,the audio I/O interface component 646 includes a headphone jackconfigured to provide connectivity for headphones or other externalspeakers. In some configurations, the audio I/O interface component 646includes a speaker for the output of audio signals. In someconfigurations, the audio I/O interface component 646 includes anoptical audio cable out.

The video I/O interface component 648 is configured to provide videoinput and/or output capabilities to the computing device. In someconfigurations, the video I/O interface component 648 includes a videoconnector configured to receive video as input from another device(e.g., a video media player such as a DVD or BLURAY player) or sendvideo as output to another device (e.g., a monitor, a television, orsome other external display). In some configurations, the video I/Ointerface component 648 includes a High-Definition Multimedia Interface(“HDMI”), mini-HDMI, micro-HDMI, DisplayPort, or proprietary connectorto input/output video content. In some configurations, the video I/Ointerface component 648 or portions thereof is combined with the audioI/O interface component 646 or portions thereof.

The camera 650 can be configured to capture still images and/or video.The camera 650 may utilize a charge coupled device (“CCD”) or acomplementary metal oxide semiconductor (“CMOS”) image sensor to captureimages. In some configurations, the camera 650 includes a flash to aidin taking pictures in low-light environments. Settings for the camera650 may be implemented as hardware or software buttons.

Although not illustrated on FIG. 6, one or more hardware buttons mayalso be included in the computing device architecture 600. The hardwarebuttons may be used for controlling some operational aspect of thecomputing device. The hardware buttons may be dedicated buttons ormulti-use buttons. The hardware buttons may be mechanical orsensor-based.

The illustrated power components 612 include one or more batteries 652,which can be connected to a battery gauge 654. The batteries 652 may berechargeable or disposable. Rechargeable battery types include, but arenot limited to, lithium polymer, lithium ion, nickel cadmium, and nickelmetal hydride. Each of the batteries 652 may be made of one or morecells.

The battery gauge 654 can be configured to measure battery parameterssuch as current, voltage, and temperature. In some configurations, thebattery gauge 654 is configured to measure the effect of a battery'sdischarge rate, temperature, age and other factors to predict remaininglife within a certain percentage of error. In some configurations, thebattery gauge 654 provides measurements to an application program thatis configured to utilize the measurements to present useful powermanagement data to a user. Power management data may include one or moreof a percentage of battery used, a percentage of battery remaining, abattery condition, a remaining time, a remaining capacity (e.g., in watthours), a current draw, and a voltage.

The power components 612 may also include a power connector, which maybe combined with one or more of the aforementioned I/O components 610.The power components 612 may interface with an external power system orcharging equipment via an I/O component.

Example Clauses

The disclosure presented herein encompasses the subject matter set forthin the following clauses.

Clause 1. A printed circuit board (PCB) apparatus, comprising: aplurality of PCB layers; an electrical component interface disposed onat least one of the plurality of PCB layers; and at least one vibrationdamping layer disposed between the plurality PCB layers.

Clause 2. The PCB apparatus according to clause 1, wherein theelectrical component interface comprises a plurality of electricalcontacts for receiving electrical terminals associated with anelectrical component, the at least one vibration damping layer disposedbelow the plurality of electrical contacts.

Clause 3. The PCB apparatus according to clause 2, wherein the at leastone vibration damping layer disposed below the plurality of electricalcontacts has a damping layer portion that at least partially overlaps anelectrical contact portion associated with at least one of the pluralityof electrical contacts.

Clause 4. The PCB apparatus according to clause 2, wherein the at leastone vibration damping layer disposed below the plurality of electricalcontacts has a damping layer portion that overlaps an electrical contactportion associated with a first electrical contact of the plurality ofelectrical contacts and an electrical contact portion associated with asecond electrical contact of the plurality of electrical contacts.

Clause 5. The PCB apparatus according to at least one of clauses 1-4,wherein the at least one vibration damping layer is a polymer layer.

Clause 6. The PCB apparatus according to clause 5, wherein the polymerlayer comprises at least one of silicone, polypropylene, andpolyurethane.

Clause 7. The PCB apparatus according to at least one of clauses 1-6,wherein the at least one vibration damping layer comprises a woven fibercloth impregnated with resin.

Clause 8. The PCB apparatus according to at least one of clauses 1-7,wherein the at least one vibration damping layer comprises resinincluding continuous or discontinuous fibers.

Clause 9. A printed circuit board (PCB) apparatus, comprising: aplurality of PCB layers; a first electrical component interface and asecond electrical component interface disposed on a surface of a layerof the plurality of PCB layers; an electrical component having a firstterminal and a second terminal, the first terminal coupled to the firstelectrical component interface and the second terminal coupled to thesecond electrical component interface; and a vibration damping layerdisposed between the plurality of PCB layers and at least partiallybelow the electrical component, the vibration damping layer to absorbvibrations in one or more of the plurality PCB layers, the vibrationscaused by the electrical component when a voltage is applied thereto.

Clause 10. The PCB apparatus according to clause 9, wherein theelectrical component is a capacitor.

Clause 11. The PCB apparatus according to clause 10, wherein thecapacitor is a multilayer ceramic capacitor comprising at least one ormore materials that produce an oscillating piezoelectric force when thevoltage is applied to the capacitor, the oscillating piezoelectric forcecausing the vibrations in the one or more of the plurality of PCBlayers.

Clause 12. The PCB apparatus according to at least one of clauses 9-11,wherein the vibration damping layer is disposed below the firstterminal, the second terminal and the electrical component.

Clause 13. The PCB apparatus according to at least one of clauses 9-12,wherein the vibration damping layer is a polymer layer.

Clause 14. The PCB apparatus according to clause 13, wherein the polymerlayer comprises at least one of silicone, polypropylene, andpolyurethane.

Clause 15. The PCB apparatus according to at least one of clauses 9-14,wherein the vibration damping layer comprises resin including continuousor discontinuous fibers.

Clause 16. A method, comprising: providing a first printed circuit board(PCB) layer; providing a vibration damping layer over at least a portionof a surface of the first PCB layer; providing a second PCB layer overthe vibration damping layer and the first printed circuit board layer;and disposing an electrical component interface on a surface of thesecond PCB layer, the electrical component interface to electricallycouple to an electrical component, wherein the vibration damping layeris disposed to absorb vibrations in one or more of the first and secondPCB layers.

Clause 17. The method according to clause 16, wherein the vibrations inthe one or more of the first and second PCB layers are caused byoscillations of the electrical component when a voltage is appliedthereto.

Clause 18. The method according to at least one of clauses 16-17,wherein a damping layer portion of the vibration damping layer at leastpartially overlaps an electrical component interface portion of theelectrical component interface on the surface of the second PCB layer.

Clause 19. The method according to at least one of clauses 16-18,further comprising providing a third PCB layer, the third PCB layerdisposed below the first PCB layer, and providing another vibrationdamping layer over the third PCB layer, wherein the another vibrationdamping layer is disposed between the first PCB layer and the second PCBlayer.

Clause 20. The method according to clause 19, wherein the vibrationdamping layer and the another vibration damping layer are offset fromone another.

Although the techniques have been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the appended claims are not necessarily limited to the features oracts described. Rather, the features and acts are described as exampleimplementations of such techniques.

The implementations described herein address the technical need toprovide a PCB that absorbs vibrations generated by electrical componentscoupled to the PCB. Such vibrations may cause the PCB to vibrate. Thevibrations associated with the PCB may be audible to a user of acomputing device incorporating the PCB. Such audible vibrations maycreate an undesirable user experience associated with operating thecomputing device incorporating the PCB. To address at least thistechnical need, the implementations described herein provide a PCB thatincorporates at least one vibration damping layer. The at least onevibration damping layer is functional to absorb some or all of thevibrations generated by electrical components coupled to the PCB andconveyed to the PCB. Other technical benefits not specificallyidentified herein can also be realized through implementations of thedisclosed technologies.

The operations of the example methods are illustrated in individualblocks and summarized with reference to those blocks. The methods areillustrated as logical flows of blocks, each block of which canrepresent one or more operations that can be implemented in hardware,software, or a combination thereof. In the context of software, theoperations represent computer-executable instructions stored on one ormore computer-readable media that, when executed by one or moreprocessors, enable the one or more processors to perform the recitedoperations. Generally, computer-executable instructions includeroutines, programs, objects, modules, components, data structures, andthe like that perform particular functions or implement particularabstract data types. The order in which the operations are described isnot intended to be construed as a limitation, and any number of thedescribed operations can be executed in any order, combined in anyorder, subdivided into multiple sub-operations, and/or executed inparallel to implement the described processes. The described processescan be performed by resources associated with one or more device(s) suchas one or more internal or external CPUs or GPUs, and/or one or morepieces of hardware logic such as FPGAs, DSPs, or other types ofaccelerators.

All of the methods and processes described above may be embodied in, andfully automated via, software code modules executed by one or moregeneral purpose computers or processors. The code modules may be storedin any type of computer-readable storage medium or other computerstorage device. Some or all of the methods may alternatively be embodiedin specialized computer hardware.

Conditional language such as, among others, “can,” “could,” “might” or“may,” unless specifically stated otherwise, are understood within thecontext to present that certain examples include, while other examplesdo not include, certain features, elements and/or steps. Thus, suchconditional language is not generally intended to imply that certainfeatures, elements and/or steps are in any way required for one or moreexamples or that one or more examples necessarily include logic fordeciding, with or without user input or prompting, whether certainfeatures, elements and/or steps are included or are to be performed inany particular example. Conjunctive language such as the phrase “atleast one of X, Y or Z,” unless specifically stated otherwise, is to beunderstood to present that an item, term, etc. may be either X, Y, or Z,or a combination thereof.

Any routine descriptions, elements or blocks in the flow diagramsdescribed herein and/or depicted in the attached figures should beunderstood as potentially representing modules, segments, or portions ofcode that include one or more executable instructions for implementingspecific logical functions or elements in the routine. Alternateimplementations are included within the scope of the examples describedherein in which elements or functions may be deleted, or executed out oforder from that shown or discussed, including substantiallysynchronously or in reverse order, depending on the functionalityinvolved as would be understood by those skilled in the art. It shouldbe emphasized that many variations and modifications may be made to theabove-described examples, the elements of which are to be understood asbeing among other acceptable examples. All such modifications andvariations are intended to be included herein within the scope of thisdisclosure and protected by the following claims.

1. A printed circuit board (PCB) apparatus, comprising: a plurality ofPCB layers; an electrical component interface disposed on at least oneof the plurality of PCB layers, the electrical component interfacecomprising a plurality of electrical contacts for receiving electricalterminals associated with an electrical component; and at least onevibration damping layer disposed between the plurality PCB layers andbelow the plurality of electrical contacts, the at least one vibrationdamping layer having a damping layer portion that overlaps an electricalcontact portion associated with a first electrical contact of theplurality of electrical contacts and an electrical contact portionassociated with a second electrical contact of the plurality ofelectrical contacts.
 2. (canceled)
 3. (canceled)
 4. (canceled)
 5. ThePCB apparatus according to claim 1, wherein the at least one vibrationdamping layer is a polymer layer.
 6. The PCB apparatus according toclaim 5, wherein the polymer layer comprises at least one of silicone,polypropylene, and polyurethane.
 7. The PCB apparatus according to claim1, wherein the at least one vibration damping layer comprises a wovenfiber cloth impregnated with resin.
 8. The PCB apparatus according toclaim 1, wherein the at least one vibration damping layer comprisesresin including continuous or discontinuous fibers.
 9. A printed circuitboard (PCB) apparatus, comprising: a plurality of PCB layers; a firstelectrical component interface and a second electrical componentinterface disposed on a surface of a layer of the plurality of PCBlayers; an electrical component having a first terminal and a secondterminal, the first terminal coupled to the first electrical componentinterface and the second terminal coupled to the second electricalcomponent interface; and a vibration damping layer disposed between theplurality of PCB layers and at least partially below the electricalcomponent, the vibration damping layer having a damping layer portionthat overlaps a portion of the first electrical component interface anda portion of the second electrical component interface, the vibrationdamping layer to absorb vibrations in one or more of the plurality PCBlayers, the vibrations caused by the electrical component when a voltageis applied thereto.
 10. The PCB apparatus according to claim 9, whereinthe electrical component is a capacitor.
 11. The PCB apparatus accordingto claim 10, wherein the capacitor is a multilayer ceramic capacitorcomprising at least one or more materials that produce an oscillatingpiezoelectric force when the voltage is applied to the capacitor, theoscillating piezoelectric force causing the vibrations in the one ormore of the plurality of PCB layers.
 12. The PCB apparatus according toclaim 9, wherein the vibration damping layer is disposed below the firstterminal, the second terminal and the electrical component.
 13. The PCBapparatus according to claim 9, wherein the vibration damping layer is apolymer layer.
 14. The PCB apparatus according to claim 13, wherein thepolymer layer comprises at least one of silicone, polypropylene, andpolyurethane.
 15. The PCB apparatus according to claim 9, wherein thevibration damping layer comprises resin including continuous ordiscontinuous fibers.
 16. A method, comprising: providing a firstprinted circuit board (PCB) layer; providing a vibration damping layerover at least a portion of a surface of the first PCB layer; providing asecond PCB layer over the vibration damping layer and the first printedcircuit board layer; and disposing an electrical component interface ona surface of the second PCB layer, the electrical component interface toelectrically couple to an electrical component, the electrical componentinterface comprising a plurality of electrical contacts for receivingelectrical terminals associated with an electrical component, whereinthe vibration damping layer is disposed to absorb vibrations in one ormore of the first and second PCB layers, the vibration damping layerdisposed below the plurality of electrical contacts, the vibrationdamping layer having a damping layer portion that overlaps an electricalcontact portion associated with a first electrical contact of theplurality of electrical contacts and an electrical contact portionassociated with a second electrical contact of the plurality ofelectrical contacts.
 17. The method according to claim 16, wherein thevibrations in the one or more of the first and second PCB layers arecaused by oscillations of the electrical component when a voltage isapplied thereto.
 18. (canceled)
 19. The method according to claim 16,further comprising providing a third PCB layer, the third PCB layerdisposed below the first PCB layer, and providing another vibrationdamping layer over the third PCB layer, wherein the another vibrationdamping layer is disposed between the first PCB layer and the second PCBlayer.
 20. The method according to claim 19, wherein the vibrationdamping layer and the another vibration damping layer are offset fromone another.